Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11997787 | Wiring substrate and method of manufacturing wiring substrate | Hikaru Tanaka | 2024-05-28 |
| 11864312 | Printed circuit board and method of manufacturing printed circuit board | Hiroshi Ueda, Ippei TANAKA, Masamichi Yamamoto | 2024-01-02 |