Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12106868 | Insulated wire | Takahiro Iwamoto, Hirotsugu Mochida | 2024-10-01 |
| RE49929 | Substrate for high-frequency printed wiring board | Shingo Kaimori, Kentaro Okamoto, Satoshi KIYA, Kazuo Murata | 2024-04-16 |