Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12058812 | Substrate for a printed wiring board | Takuto HIDANI, Haruka Okamoto | 2024-08-06 |
| 12016132 | Base material for printed circuit board and method of manufacturing base material for printed circuit board | Masamichi Yamamoto | 2024-06-18 |