Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046705 | Method of manufacturing light source device having a bonding layer with bumps and a bonding member | Takashi Matsumoto, Fukutaro Saegusa, Yoshiyuki Kageyama | 2024-07-23 |