Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033927 | Method for manufacturing wiring substrate | Tomoya DAIZO, Yoji Sawada, Kazuhiko Kuranobu | 2024-07-09 |
| 11935822 | Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate | Tomoya DAIZO, Yoji Sawada, Kazuhiko Kuranobu | 2024-03-19 |