Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955531 | Method of forming an integrated circuit device having a contact capping layer | Dae Young Kwak, Ji-ye Kim, Min Chan Gwak, Dong-Hyun Roh, Jin-Wook Lee +1 more | 2024-04-09 |