Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887948 | Integrated circuit chip including a passivation nitride layer in contact with a high voltage bonding pad and method of making | Simone Dario MARIANI, Elisabetta Pizzi | 2024-01-30 |