Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170262 | Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device | David Auchere, Asma HAJJI, Fabien Quercia | 2024-12-17 |
| 11984373 | Package for integrated circuit and manufacturing method | — | 2024-05-14 |
| 11862757 | Electronic package | Olivier ZANELLATO, Remi Brechignac | 2024-01-02 |