Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11959866 | Live flaw detection system for multi-bundled conductor splicing sleeve and application method thereof | Dehua Zou, Zhipeng JIANG, Zhenyu Wang, Bocheng LI, Qiaosha Xiao +4 more | 2024-04-16 |