Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009854 | Mobile device case with bonded soft resin insert and shell | Alan Yu Tung Ng, Monica Elizabeth Wright, Darrick Del Moral, Bryan Lee Hynecek, Harlan Seth Dannenberg +2 more | 2024-06-11 |