Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11992901 | Lead-free and halogen-free solder paste | Qiaosheng Ye | 2024-05-28 |
| 11862786 | Three-dimensional porous graphene foam material to prepare bone defect filler | Qi Zhang, Yuyou Qiu, Wenjun Shao, Can Xiao, Ruoqi Cao +2 more | 2024-01-02 |