Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11931995 | Bonding method and bonding apparatus | Katsuhiro Iino | 2024-03-19 |
| 11877728 | Imaging module and imaging device | Takahiro Furuya, Takatoshi Kamei, Tsutomu Inaba, Bin Qi, Yoshihiro Egashira | 2024-01-23 |