Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028985 | Electrical device having heat dissipation structure using filler and manufacturing method of the same | Jun Kyu Lee, Jeong Man Han, Su Young Kim, Sang Keun Ji, Dong Kyun Ryu | 2024-07-02 |