Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119295 | Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof | Chengchung Lin | 2024-10-15 |
| 12113045 | Three-dimensional stacked fan-out packaging structure and method making the same | Chengchung Lin | 2024-10-08 |
| 12040546 | Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same | Chengchung Lin | 2024-07-16 |
| 11973070 | Double-layer stacked 3D fan-out packaging structure and method making the same | Chengchung Lin | 2024-04-30 |
| 11894243 | Wafer system-level fan-out packaging structure and manufacturing method | Chengchung Lin | 2024-02-06 |
| 11894357 | System-level packaging structure and method for LED chip | Chengchung Lin | 2024-02-06 |