Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159805 | Method for producing wafers with modification lines of defined orientation | Ralf Rieske, Christian Beyer, Jan Richter | 2024-12-03 |
| 12151314 | Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack | Ralf Rieske, Christian Beyer, Jan Richter | 2024-11-26 |
| 12107017 | Method and apparatus for producing at least one modification in a solid body | Ralf Rieske, Albrecht Ullrich | 2024-10-01 |
| 12097641 | Method for forming a crack in an edge region of a donor substrate | Christian Beyer, Franz Schilling, Jan Richter | 2024-09-24 |
| 12030216 | Method for separating wafers from donor substrates | Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter | 2024-07-09 |
| 11869810 | Method for reducing the thickness of solid-state layers provided with components | Ralf Rieske, Christian Beyer, Jan Richter | 2024-01-09 |