Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100633 | Electronic package comprising wire inside an electronic component | Ho-Chuan Lin, Chia-Chu Lai | 2024-09-24 |
| 12100648 | Electronic module, manufacturing method thereof and electronic package having the same | Ho-Chuan Lin, Chia-Chu Lai | 2024-09-24 |
| 12068211 | Electronic package comprising multiple wires inside an electronic component | Ho-Chuan Lin, Chia-Chu Lai | 2024-08-20 |
| 12027753 | Electronic package and antenna structure thereof | Chia-Chu Lai, Ho-Chuan Lin | 2024-07-02 |
| 12014967 | Manufacturing method of electronic package comprising a wire within an electronic component | Ho-Chuan Lin, Chia-Chu Lai | 2024-06-18 |