Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114427 | Method for fabricating assemble substrate | Wen-Liang Lien | 2024-10-08 |
| 12009340 | Method for fabricating electronic package | Feng Kao, Mao-Hua Yeh | 2024-06-11 |
| 11984393 | Electronic package, manufacturing method for the same, and electronic structure | Feng Kao | 2024-05-14 |
| 11973047 | Electronic package including electronic structure and electronic component | Feng Kao | 2024-04-30 |