Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033868 | Electronic package and method for fabricating the same | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2024-07-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033868 | Electronic package and method for fabricating the same | Shu-Chi Chang, Wei Wang, Hsien-Lung Hsiao | 2024-07-09 |