Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100641 | Electronic package and method for manufacturing the same | Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chien-Cheng Lin | 2024-09-24 |
| 12057409 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh +1 more | 2024-08-06 |