Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142873 | Electronic device and waterproof member thereof | Kai-Hsiang Chou | 2024-11-12 |
| 12094727 | Method forming a semiconductor package device | Yi-Hung Chien, Chun-Ying Wang, Hsiu-Yuan CHEN, Bing Wu | 2024-09-17 |