Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176326 | Method of forming semiconductor device using high stress cleave plane | Michael I. Current | 2024-12-24 |
| 11901351 | Three dimensional integrated circuit with lateral connection layer | Michael I. Current | 2024-02-13 |