Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11932786 | Method for structurally joining substrates having different coefficients of linear thermal expansion | Urs Rheinegger, Elyes Jendoubi, Christian Krüger | 2024-03-19 |
| 11891507 | Thermosetting epoxy resin composition having low curing temperature and good storage stability | Noah MUNZINGER | 2024-02-06 |