Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136603 | Semiconductor arrangement comprising a semiconductor element, a substrate and bond connecting means | FELIX ZEYSS | 2024-11-05 |
| 11888407 | Power module having at least two power semiconductor arrangements that are contacted on a substrate | ROBERT GOSPOS, Lutz Namyslo, FELIX ZEYSS, Michael Endres, Silvio Höhne +1 more | 2024-01-30 |