Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11972998 | Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package device | — | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11972998 | Semiconductor package device with dedicated heat-dissipation feature and method of manufacturing semiconductor package device | — | 2024-04-30 |