Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101894 | Wiring board | Junichi Nakamura, Takeshi Takai, Yoshihisa Kanbe, Shuhei Momose, Toshiki Shirotori | 2024-09-24 |
| 12033802 | Multilayer capacitor having sintered electrode layer with wraparound portion | Toru Onoue, Daisuke Himeta | 2024-07-09 |