Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955403 | Header for semiconductor package and semiconductor package | Takumi Ikeda | 2024-04-09 |
| 11923652 | Header for semiconductor package, and semiconductor package | Takumi Ikeda | 2024-03-05 |