Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107067 | Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program | Hiroaki Yoshino | 2024-10-01 |
| 12107070 | Wire bonding apparatus and method for manufacturing semiconductor device | Hiroaki Yoshino | 2024-10-01 |