OK

Osamu Kakutani

SH Shinkawa: 2 patents #2 of 29Top 7%
📍 Tokyo, WA: #13 of 34 inventorsTop 40%
Overall (2024): #129,712 of 561,600Top 25%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12080679 Bonding apparatus and alignment method Toru Maeda 2024-09-03
12057427 Wire bonding apparatus Shigeru Hayata 2024-08-06