Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12116304 | Method for packing quartz glass cloth | Hajime ITOKAWA, Ryunosuke Nomura | 2024-10-15 |
| 12098290 | Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder | Hajime ITOKAWA | 2024-09-24 |
| 12035461 | Low dielectric substrate for high-speed millimeter-wave communication | Yusuke Taguchi, Ryunosuke Nomura | 2024-07-09 |
| 11920011 | Resin substrate having dielectric characteristics with little frequency dependence | Yusuke Taguchi, Ryunosuke Nomura, Hajime ITOKAWA | 2024-03-05 |