Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11970639 | Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer | Michihiro Sugo, Shohei Tagami | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11970639 | Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer | Michihiro Sugo, Shohei Tagami | 2024-04-30 |