Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1054388 | Carrier substrate for handling | Yoshinori Ogawa, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2024-12-17 |
| 11862754 | Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |
| 11862755 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |