Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104054 | Resin composition, prepreg containing same, laminate, and printed circuit board | Liexiang He, Yongnian Qi, Xianping Zeng, Hualin Pan | 2024-10-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12104054 | Resin composition, prepreg containing same, laminate, and printed circuit board | Liexiang He, Yongnian Qi, Xianping Zeng, Hualin Pan | 2024-10-01 |