Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12171057 | Manufacturing method for pcb with thermal conductor embedded therein, and pcb | Hongyu Wu, Chengguang Ji, Mengru Liu, Zhengqing Chen, Hongbing Du +1 more | 2024-12-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12171057 | Manufacturing method for pcb with thermal conductor embedded therein, and pcb | Hongyu Wu, Chengguang Ji, Mengru Liu, Zhengqing Chen, Hongbing Du +1 more | 2024-12-17 |