Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112529 | Apparatus and method for segmenting steel microstructure phase | Soon Woo Kwon, Chung An Lee, Hyun Ki Kim, Seung Hyun Hong, Jun Yun Kang | 2024-10-08 |
| 11898231 | Steel for gear and method for manufacturing gear using the same | In Beom Lee, Dong Hwi Kim, Chang Won Kang, Myung-Sik Kim, Sung Min Hong +2 more | 2024-02-13 |
| 11862455 | Chip-scale package light emitting diode | Jong Kyu Kim, Se Hee Oh, Hyoung Jin Lim | 2024-01-02 |