Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051665 | Hybridization bumps for fine pitch sensor arrays | Wei Huang, Sungjin Kim, Michael John Evans, De Hsin Chang, Wei Zhang | 2024-07-30 |
| 11923470 | Visible-swir hyper spectral photodetectors with reduced dark current | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Sean T. Houlihan | 2024-03-05 |