Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12017306 | Solder paste | Takeshi Sakamoto, Shunsuke KOGA | 2024-06-25 |
| 11911854 | Solder alloy, solder paste, solder preform and solder joint | Takeshi Sakamoto | 2024-02-27 |
| 11904416 | Solder alloy, solder powder, solder paste and solder joint | Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi | 2024-02-20 |
| 11858071 | Solder alloy, solder paste, solder ball, solder preform, and solder joint | Ryuki Horie | 2024-01-02 |