Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027190 | Method of for bonding noble metal structure with a dielectric layer using an adhesive layer | — | 2024-07-02 |
| 11875826 | Heat-assisted magnetic recording head with a bilayer adhesion structure | Michael C. Kautzky, Venkateswara Rao Inturi, Lance Nevala, Tong Zhao | 2024-01-16 |