Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028963 | Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer | — | 2024-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028963 | Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer | — | 2024-07-02 |