Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009634 | Header and package with integrated cooler for electronic components | Andreas Krause, Amy Soon Li Ping, Ong Wai Li, Artit Aowudomsuk | 2024-06-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009634 | Header and package with integrated cooler for electronic components | Andreas Krause, Amy Soon Li Ping, Ong Wai Li, Artit Aowudomsuk | 2024-06-11 |