Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12108577 | Self-aligning heat fins for thermal management | Vijay A/L Mohanarao | 2024-10-01 |
| 11948924 | Combined semiconductor device packaging system | Toh Kok Wei | 2024-04-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12108577 | Self-aligning heat fins for thermal management | Vijay A/L Mohanarao | 2024-10-01 |
| 11948924 | Combined semiconductor device packaging system | Toh Kok Wei | 2024-04-02 |