Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136590 | Semiconductor package and method of manufacturing the same | — | 2024-11-05 |
| D1039574 | Indexable drill insert for machine tools for metalworking | Hong Seung Son, Young Heum Kim | 2024-08-20 |
| 12002784 | Semiconductor package | — | 2024-06-04 |
| 11996366 | Semiconductor package including interposer | Seung-Kwan Ryu | 2024-05-28 |
| 11954938 | Fingerprint sensor package and smart card including fingerprint sensor package | Gwangjin LEE, Jaehyun LIM, Heeyoub Kang, HyunJong Moon, Inho Choi | 2024-04-09 |
| 11887919 | Semiconductor package | — | 2024-01-30 |