Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159858 | Semiconductor package and method of fabricating the same | Hyunsoo Chung, Inhyo Hwang | 2024-12-03 |
| 12100635 | Semiconductor package and method of fabricating the same | Sanghoon Jung, Cheolsoo HAN | 2024-09-24 |
| 12100681 | Semiconductor package and method of fabricating the same | — | 2024-09-24 |
| 12033948 | Semiconductor package | Hyunsoo Chung, Inhyo Hwang | 2024-07-09 |
| 12002786 | Semiconductor package and method of fabricating the same | — | 2024-06-04 |