Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027432 | Semiconductor packages | — | 2024-07-02 |
| 11996378 | Semiconductor package and method for manufacturing semiconductor package | Yongjin Park | 2024-05-28 |
| 11961792 | Fan-out semiconductor package including under-bump metallurgy | — | 2024-04-16 |