Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114428 | Electronic component embedded substrate | Yun Je Ji, Seung Eun Lee | 2024-10-08 |
| 12108534 | Substrate structure and electronic device including the same | Seung Eun Lee | 2024-10-01 |
| 12108535 | Printed circuit board and printed circuit board package | Kwang Yun KIM, Seung Eun Lee | 2024-10-01 |
| 11963311 | Printed circuit board and method of manufacturing the same | Jae Woong Choi, Yun Je Ji, Seung Eun Lee | 2024-04-16 |
| 11894191 | Multilayer electronic component | Jae Hoon Kim, Ji Hoon Kim, Gyoung Heon KO | 2024-02-06 |
| 11882652 | Printed circuit board | Yun Je Ji, Seung Eun Lee | 2024-01-23 |