Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862548 | Package substrate film and semiconductor package including the same | Kyoungsuk YANG, Soyoung Lim | 2024-01-02 |
YC
Yechung Chung
Overall (2024): #211,430 of 561,600Top 40%
1
Patents 2024