Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154881 | Integrated circuit device having redistribution pattern | Yunrae Cho, Jinyeol Yang, Jungmin Ko | 2024-11-26 |
| 12125753 | Semiconductor package including test bumps | Taehyeong Kim, Hyeongmun Kang | 2024-10-22 |