Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955464 | Semiconductor package having pads with stepped structure | Hyun-Soo Chung, Tae Won Yoo | 2024-04-09 |
MC
Myung-Kee Chung
Overall (2024): #332,644 of 561,600Top 60%
1
Patents 2024