Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935868 | Semiconductor package including plurality of semiconductor chips and method for manufacturing the same | Dongkwan Kim | 2024-03-19 |
| 11908727 | Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same | Seung Hwan Lee | 2024-02-20 |