Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923314 | Semiconductor package including a trench in a passivation layer | Ik Kyu Jin, Jin Su Kim | 2024-03-05 |
| 11894310 | Fan-out semiconductor package | Myung Sam Kang, Young Chan Ko, Jeong Seok Kim, Bong Ju Cho | 2024-02-06 |