Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183783 | Stacked structure including two-dimensional material and method of fabricating the stacked structure | Alum Jung, Kyung-Eun BYUN | 2024-12-31 |
| 12183780 | Metal-to-semiconductor contact including a 2D crystal material layer | Yeonchoo Cho, Kyung-Eun BYUN, Hyeonjin Shin | 2024-12-31 |
| 12183582 | Film deposition method and element including film deposited by the film deposition method | Changseok LEE, Sangwon Kim | 2024-12-31 |
| 12131905 | Graphene structure and method of forming the graphene structure | Kyungeun Byun, Hyeonjin Shin, Soyoung Lee, Changseok LEE | 2024-10-29 |
| 12103850 | Method of forming graphene | Van Luan NGUYEN, Hyeonjin Shin, Changhyun KIM, Changseok LEE, Yeonchoo Cho | 2024-10-01 |
| 12087840 | Semiconductor device and capacitor including hydrogen-incorporated oxide layer | Taehwan MOON, Jinseong HEO | 2024-09-10 |
| 12080595 | Method of forming interconnect structure | Sanghoon Ahn, Woojin Lee, Kyung-Eun BYUN, Junghoo Shin, Hyeonjin Shin +1 more | 2024-09-03 |
| 12027589 | Semiconductor device including graphene and method of manufacturing the semiconductor device | Hyeonjin Shin, Yeonchoo Cho, Seunggeol NAM, Seongjun Park, Yunseong LEE | 2024-07-02 |
| 12014991 | Interconnect structure including graphene-metal barrier and method of manufacturing the same | Kibum Kim, Hyunmi Kim, Hyeonjin Shin, Sanghun Lee | 2024-06-18 |
| 11978704 | Wiring structure and electronic device employing the same | Changseok LEE, Hyeonjin Shin, Seongjun Park, Donghyun Im, Hyun-Ho Park +2 more | 2024-05-07 |
| 11908918 | Electronic device and method of manufacturing the same | Jinseong HEO, Yunseong LEE, Sanghyun Jo, Hyeonjin Shin | 2024-02-20 |
| 11887850 | Method of forming carbon layer and method of forming interconnect structure | Hyeonjin Shin | 2024-01-30 |